On the morning of December 15, the project of Solidic IC Packaging and Testing Industrial Park started in Wangcheng Economic and Technological Development Zone to promote the high-quality development of Wangcheng intelligent terminal industry. Li Weifeng, member of the party working committee and deputy director of the management committee of the park, attended the groundbreaking ceremony.

Hunan Solidic is a chip design enterprise integrating sensing, computing, controlling and transmitting in the whole intelligent measurement and control process, focusing on the R&D and design of sensors, ADCs, all kinds of control and transmission chips, and related application solutions, and its parent company, Shenzhen Solidic, is a national small-giant enterprise with rich experience in the field of chip design. We have rich experience in the field of chip design.

The Hunan Solidic IC Packaging and Testing Industrial Park with a planned land of 30 acres, a total construction area of 39,139 square meters and a total investment of 500 million yuan, the project will create a one-stop chip packaging and testing solutions professional park based on advanced packaging technology, as well as ‘IC testing’, ‘module processing’, ‘system integration’ and other functions, the main products include ‘MEMS sensors’, ‘biomedical chips’ and so on. The project will create a professional park with one-stop chip testing solutions based on advanced packaging technology and functions such as ‘IC testing’, ‘module processing’ and ‘system integration’, and the main products include ‘MEMS sensors’ and ‘biomedical chips’.